Assessor Resource

MEA262
Modify/repair aircraft component single layer printed circuit boards

Assessment tool

Version 1.0
Issue Date: May 2024


This unit of competency requires application of hand skills, including high reliability hand soldering, and knowledge of standard practices and techniques in the repair of single layer printed circuit boards from aircraft avionic components that are repaired in aviation workshops during scheduled or unscheduled maintenance. Work may be performed individually or as part of a team.

The unit is used in workplaces that operate under the airworthiness regulatory systems of the Australian Defence Force (ADF) and the Civil Aviation Safety Authority (CASA).

You may want to include more information here about the target group and the purpose of the assessments (eg formative, summative, recognition)



Evidence Required

List the assessment methods to be used and the context and resources required for assessment. Copy and paste the relevant sections from the evidence guide below and then re-write these in plain English.

Elements describe the essential outcomes.

Performance criteria describe the performance needed to demonstrate achievement of the element.

1.

Inspect single layer printed circuit cards and associated components

1.1

Relevant maintenance documentation, including component defect reports, where applicable, is interpreted and matched by part and serial number

1.2

Preparation of work area and circuit card assemblies is appropriate to allow for effective detailed inspection of all substrate, circuit tracks, edge connectors and attached components, taking into account any static discharge procedures

1.3

Circuit card assemblies are visually or physically inspected for physical integrity of substrate, circuit tracks, edge connectors and attached components

1.4

Modification status is established to assist in determining repair requirements

1.5

Defects are correctly identified and reported

2.

Test single layer printed circuit cards and associated components

2.1

Circuit card assemblies are correctly prepared and connected to the appropriate test facility in accordance with approved procedures, or circuit card assemblies are correctly prepared and connected in situ to allow required test procedures to be performed

2.2

Circuit card assemblies are functionally tested in accordance with normal trade practice and approved maintenance documentation for evidence of serviceability or malfunction

2.3

Circuit card assemblies, attached hardware and electronic components are electronically and/or physically adjusted/aligned in accordance with maintenance manuals or other prescribed procedures

3.

Troubleshoot single layer printed circuit cards and associated components

3.1

Maintenance documentation, physical inspection and test results are used, where applicable, to assist in fault determination

3.2

Maintenance manual fault diagnosis guides, logical processes and test equipment are used appropriately to ensure efficient and accurate troubleshooting

3.3

Component faults are located and the causes of the faults are clearly identified and recorded in maintenance documentation, where required

3.4

Rectification requirements are determined

4.

Dismantle single layer printed circuit cards and associated components

4.1

Conformal/protective coatings are removed from the circuit card assembly to the extent required to effect necessary repairs and in accordance with maintenance manuals, and industry or enterprise standards as applicable

4.2

Appropriate work health and safety (WHS) requirements are observed at all times during maintenance procedures and applicable material safety data sheets (MSDS) and personal protective equipment (PPE) are used

4.3

Circuit card assembly is dismantled to the extent necessary to allow repair of all identified faults

4.4

Parts for processing are correctly tagged and despatched

4.5

Parts for retention and re-fitment are correctly packaged and stored in accordance with approved procedures to avoid physical and electrostatic damage

4.6

Parts for disposal are correctly packaged and processed to accord with statutory requirements pertaining to dangerous goods

5.

Assemble single layer printed circuit cards and associated components

5.1

Parts removed for access, and replacement parts, are collected ensuring appropriate modification status, component tolerances and assembly configuration is maintained

5.2

Printed circuit card and associated components are assembled in accordance with maintenance manuals, and all electrical joints meet the approved standard of the equipment manufacturer, or industry standard, as appropriate

5.3

Circuit substrate material, circuit tracks, edge connectors and through-hole eyelets are reworked, as necessary, to restore printed circuit card to a serviceable condition

5.4

Any conformal/protective coatings removed are replaced to the approved standard of the equipment manufacturer, or industry standard, as appropriate

5.5

Rework techniques are in accordance with industry approval procedures and relevant WHS precautions are observed and applicable MSDS and items of PPE are used

Evidence required to demonstrate competency in this unit must be relevant to and satisfy all of the requirements of the elements and performance criteria under the specified conditions of assessment, and include:

applying relevant WHS practices including the selection and use of PPE and the use of MSDS

using approved repair procedures and processes relating to single and double sided circuit cards

recognising unacceptable soldered connections, damage circuit card components, circuit tracks integrity, substrate damage and edge connector condition

applying static-safe work area practices

reworking unacceptable printed circuit board soldered connections, via acceptable de-soldering and soldering techniques

disassembling and assembling printed circuit board cards to approved industry standards and prescribed specifications

performing printed circuit board tests using relevant test equipment and processes to isolate printed circuit board track faults and assess serviceability state post repair

correctly disassembling, preparing repair area, reworking the card to industry standards, replacing faulted components and assembling card for post-repair inspection and testing.

It is essential that substrate abrasion and rebuilding techniques and precautions associated with handling and assembly of electrostatic and temperature sensitive devices are fully observed, understood and complied with. A high level of awareness of safety precautions associated with beryllium materials and use of fluxes and solvents is to be demonstrated.

Evidence of transferability of skills and knowledge related to single layer printed circuit card assembly and repair is essential before undertaking any action. This may be demonstrated through application of the techniques involved across a representative range of circuit card substrate materials and attached components. Use of high precision, high reliability soldering techniques and handling of components, including application of anti-static equipment, must be demonstrated.

Evidence required to demonstrate competency in this unit must be relevant to and satisfy all of the requirements of the elements and performance criteria and include knowledge of:

component operation

basic principles/functions relating to electrical and electronic components on printed circuit boards

substrate materials

types of conformal coating

types of soldering equipment and solders used in track repair and component assembly

how to obtain MSDS

WHS procedures

relevant maintenance manuals

relevant regulatory requirements and standard procedures.

Competency should be assessed in the work environment or simulated work environment, using tools and equipment specified in maintenance manuals. It is also expected that applicable general and special-purpose test equipment found in most routine situations would be used where appropriate.

The work plan should take account of applicable safety and quality requirements in accordance with the industry and regulatory standards.

The following conditions of assessment represent the requirements of the Regulators (ADF and CASA) and maintenance stakeholders and must be rigorously observed.

A person cannot be assessed as competent until it can be demonstrated to the satisfaction of the workplace assessor that the relevant elements and performance criteria of the unit of competency are being achieved under routine supervision on a representative range of cards with various substrate materials and components. This shall be established via the records in the Log of Industrial Experience and Achievement or, where appropriate, an equivalent Industry Evidence Guide (for details refer to the Companion Volume Assessment Guidelines).

Assessors must satisfy the requirements of the National Vocational Education and Training Regulator (Australian Skills Quality Authority, or its successors).


Submission Requirements

List each assessment task's title, type (eg project, observation/demonstration, essay, assingnment, checklist) and due date here

Assessment task 1: [title]      Due date:

(add new lines for each of the assessment tasks)


Assessment Tasks

Copy and paste from the following data to produce each assessment task. Write these in plain English and spell out how, when and where the task is to be carried out, under what conditions, and what resources are needed. Include guidelines about how well the candidate has to perform a task for it to be judged satisfactory.

Elements describe the essential outcomes.

Performance criteria describe the performance needed to demonstrate achievement of the element.

1.

Inspect single layer printed circuit cards and associated components

1.1

Relevant maintenance documentation, including component defect reports, where applicable, is interpreted and matched by part and serial number

1.2

Preparation of work area and circuit card assemblies is appropriate to allow for effective detailed inspection of all substrate, circuit tracks, edge connectors and attached components, taking into account any static discharge procedures

1.3

Circuit card assemblies are visually or physically inspected for physical integrity of substrate, circuit tracks, edge connectors and attached components

1.4

Modification status is established to assist in determining repair requirements

1.5

Defects are correctly identified and reported

2.

Test single layer printed circuit cards and associated components

2.1

Circuit card assemblies are correctly prepared and connected to the appropriate test facility in accordance with approved procedures, or circuit card assemblies are correctly prepared and connected in situ to allow required test procedures to be performed

2.2

Circuit card assemblies are functionally tested in accordance with normal trade practice and approved maintenance documentation for evidence of serviceability or malfunction

2.3

Circuit card assemblies, attached hardware and electronic components are electronically and/or physically adjusted/aligned in accordance with maintenance manuals or other prescribed procedures

3.

Troubleshoot single layer printed circuit cards and associated components

3.1

Maintenance documentation, physical inspection and test results are used, where applicable, to assist in fault determination

3.2

Maintenance manual fault diagnosis guides, logical processes and test equipment are used appropriately to ensure efficient and accurate troubleshooting

3.3

Component faults are located and the causes of the faults are clearly identified and recorded in maintenance documentation, where required

3.4

Rectification requirements are determined

4.

Dismantle single layer printed circuit cards and associated components

4.1

Conformal/protective coatings are removed from the circuit card assembly to the extent required to effect necessary repairs and in accordance with maintenance manuals, and industry or enterprise standards as applicable

4.2

Appropriate work health and safety (WHS) requirements are observed at all times during maintenance procedures and applicable material safety data sheets (MSDS) and personal protective equipment (PPE) are used

4.3

Circuit card assembly is dismantled to the extent necessary to allow repair of all identified faults

4.4

Parts for processing are correctly tagged and despatched

4.5

Parts for retention and re-fitment are correctly packaged and stored in accordance with approved procedures to avoid physical and electrostatic damage

4.6

Parts for disposal are correctly packaged and processed to accord with statutory requirements pertaining to dangerous goods

5.

Assemble single layer printed circuit cards and associated components

5.1

Parts removed for access, and replacement parts, are collected ensuring appropriate modification status, component tolerances and assembly configuration is maintained

5.2

Printed circuit card and associated components are assembled in accordance with maintenance manuals, and all electrical joints meet the approved standard of the equipment manufacturer, or industry standard, as appropriate

5.3

Circuit substrate material, circuit tracks, edge connectors and through-hole eyelets are reworked, as necessary, to restore printed circuit card to a serviceable condition

5.4

Any conformal/protective coatings removed are replaced to the approved standard of the equipment manufacturer, or industry standard, as appropriate

5.5

Rework techniques are in accordance with industry approval procedures and relevant WHS precautions are observed and applicable MSDS and items of PPE are used

This field allows for different work environments and conditions that may affect performance. Essential operating conditions that may be present (depending on the work situation, needs of the candidate, accessibility of the item, and local industry and regional contexts) are included.

Circuit card components include:

Capacitors, resistors, wires, semiconductors, inductors, transformers, switches, connectors, multi-pin ICs, terminal posts and heat-sink materials, and will include electrostatic sensitive devices

Procedures and standards include:

Procedures and standards for repair of printed circuit card assemblies, including a range of general engineering hand skills in addition to specific high reliability soldering skills.

Standards applicable in a given situation will be defined by equipment manufacturers and/or regulatory authorities and the enterprise

Evidence required to demonstrate competency in this unit must be relevant to and satisfy all of the requirements of the elements and performance criteria under the specified conditions of assessment, and include:

applying relevant WHS practices including the selection and use of PPE and the use of MSDS

using approved repair procedures and processes relating to single and double sided circuit cards

recognising unacceptable soldered connections, damage circuit card components, circuit tracks integrity, substrate damage and edge connector condition

applying static-safe work area practices

reworking unacceptable printed circuit board soldered connections, via acceptable de-soldering and soldering techniques

disassembling and assembling printed circuit board cards to approved industry standards and prescribed specifications

performing printed circuit board tests using relevant test equipment and processes to isolate printed circuit board track faults and assess serviceability state post repair

correctly disassembling, preparing repair area, reworking the card to industry standards, replacing faulted components and assembling card for post-repair inspection and testing.

It is essential that substrate abrasion and rebuilding techniques and precautions associated with handling and assembly of electrostatic and temperature sensitive devices are fully observed, understood and complied with. A high level of awareness of safety precautions associated with beryllium materials and use of fluxes and solvents is to be demonstrated.

Evidence of transferability of skills and knowledge related to single layer printed circuit card assembly and repair is essential before undertaking any action. This may be demonstrated through application of the techniques involved across a representative range of circuit card substrate materials and attached components. Use of high precision, high reliability soldering techniques and handling of components, including application of anti-static equipment, must be demonstrated.

Evidence required to demonstrate competency in this unit must be relevant to and satisfy all of the requirements of the elements and performance criteria and include knowledge of:

component operation

basic principles/functions relating to electrical and electronic components on printed circuit boards

substrate materials

types of conformal coating

types of soldering equipment and solders used in track repair and component assembly

how to obtain MSDS

WHS procedures

relevant maintenance manuals

relevant regulatory requirements and standard procedures.

Competency should be assessed in the work environment or simulated work environment, using tools and equipment specified in maintenance manuals. It is also expected that applicable general and special-purpose test equipment found in most routine situations would be used where appropriate.

The work plan should take account of applicable safety and quality requirements in accordance with the industry and regulatory standards.

The following conditions of assessment represent the requirements of the Regulators (ADF and CASA) and maintenance stakeholders and must be rigorously observed.

A person cannot be assessed as competent until it can be demonstrated to the satisfaction of the workplace assessor that the relevant elements and performance criteria of the unit of competency are being achieved under routine supervision on a representative range of cards with various substrate materials and components. This shall be established via the records in the Log of Industrial Experience and Achievement or, where appropriate, an equivalent Industry Evidence Guide (for details refer to the Companion Volume Assessment Guidelines).

Assessors must satisfy the requirements of the National Vocational Education and Training Regulator (Australian Skills Quality Authority, or its successors).

Copy and paste from the following performance criteria to create an observation checklist for each task. When you have finished writing your assessment tool every one of these must have been addressed, preferably several times in a variety of contexts. To ensure this occurs download the assessment matrix for the unit; enter each assessment task as a column header and place check marks against each performance criteria that task addresses.

Observation Checklist

Tasks to be observed according to workplace/college/TAFE policy and procedures, relevant legislation and Codes of Practice Yes No Comments/feedback
Relevant maintenance documentation, including component defect reports, where applicable, is interpreted and matched by part and serial number 
Preparation of work area and circuit card assemblies is appropriate to allow for effective detailed inspection of all substrate, circuit tracks, edge connectors and attached components, taking into account any static discharge procedures 
Circuit card assemblies are visually or physically inspected for physical integrity of substrate, circuit tracks, edge connectors and attached components 
Modification status is established to assist in determining repair requirements 
Defects are correctly identified and reported 
Circuit card assemblies are correctly prepared and connected to the appropriate test facility in accordance with approved procedures, or circuit card assemblies are correctly prepared and connected in situ to allow required test procedures to be performed 
Circuit card assemblies are functionally tested in accordance with normal trade practice and approved maintenance documentation for evidence of serviceability or malfunction 
Circuit card assemblies, attached hardware and electronic components are electronically and/or physically adjusted/aligned in accordance with maintenance manuals or other prescribed procedures 
Maintenance documentation, physical inspection and test results are used, where applicable, to assist in fault determination 
Maintenance manual fault diagnosis guides, logical processes and test equipment are used appropriately to ensure efficient and accurate troubleshooting 
Component faults are located and the causes of the faults are clearly identified and recorded in maintenance documentation, where required 
Rectification requirements are determined 
Conformal/protective coatings are removed from the circuit card assembly to the extent required to effect necessary repairs and in accordance with maintenance manuals, and industry or enterprise standards as applicable 
Appropriate work health and safety (WHS) requirements are observed at all times during maintenance procedures and applicable material safety data sheets (MSDS) and personal protective equipment (PPE) are used 
Circuit card assembly is dismantled to the extent necessary to allow repair of all identified faults 
Parts for processing are correctly tagged and despatched 
Parts for retention and re-fitment are correctly packaged and stored in accordance with approved procedures to avoid physical and electrostatic damage 
Parts for disposal are correctly packaged and processed to accord with statutory requirements pertaining to dangerous goods 
Parts removed for access, and replacement parts, are collected ensuring appropriate modification status, component tolerances and assembly configuration is maintained 
Printed circuit card and associated components are assembled in accordance with maintenance manuals, and all electrical joints meet the approved standard of the equipment manufacturer, or industry standard, as appropriate 
Circuit substrate material, circuit tracks, edge connectors and through-hole eyelets are reworked, as necessary, to restore printed circuit card to a serviceable condition 
Any conformal/protective coatings removed are replaced to the approved standard of the equipment manufacturer, or industry standard, as appropriate 
Rework techniques are in accordance with industry approval procedures and relevant WHS precautions are observed and applicable MSDS and items of PPE are used 

Forms

Assessment Cover Sheet

MEA262 - Modify/repair aircraft component single layer printed circuit boards
Assessment task 1: [title]

Student name:

Student ID:

I declare that the assessment tasks submitted for this unit are my own work.

Student signature:

Result: Competent Not yet competent

Feedback to student

 

 

 

 

 

 

 

 

Assessor name:

Signature:

Date:


Assessment Record Sheet

MEA262 - Modify/repair aircraft component single layer printed circuit boards

Student name:

Student ID:

Assessment task 1: [title] Result: Competent Not yet competent

(add lines for each task)

Feedback to student:

 

 

 

 

 

 

 

 

Overall assessment result: Competent Not yet competent

Assessor name:

Signature:

Date:

Student signature:

Date: